发明名称 MODULE FOR ELECTRONIC EQUIPMENT OF FLAT STRUCTURE STYLE
摘要 PURPOSE: To realize resistance against bending stress and pressing stress by directing, in a system carrier, one slit isolating a chip island from an external contactor with a particular inclination angle with respect to the edge of a square or a rectangular chip. CONSTITUTION: At the center of a system carrier 20, a square chip island 22 is provided, this chip island 22 is defined with a slit 23, and is then held at both sides with a bridging section 25. Extending portions 26, 27 which extend over a web 28 are formed to the bridging section 25 and an external contactor 21. The slit 23, isolating the chip island 22 from the external contactor 21, is set in the angle of about 45 degrees for the edge of the rectangular chip 1. Thereby, a resistance for the bending stress and pressing stress may be used effectively, when the extending portions 26, 27 are raised and bent along the line in the region of the web 28 and a window.
申请公布号 JPH06236958(A) 申请公布日期 1994.08.23
申请号 JP19930290842 申请日期 1993.11.19
申请人 ESETSUKU SEMUPATSUKU SA 发明人 KAARU NIKURAUSU
分类号 H01L23/50;B42D15/10;G06K19/077;H01L21/56;H01L23/495;H01L23/498;H05K3/34 主分类号 H01L23/50
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