| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA-type multilayer wiring board which effectively prevents the break of a connection via caused by heat generation in operating a semiconductor chip, and to provide a BGA-type semiconductor package. SOLUTION: The BGA-type multilayer wiring board 1 includes: a plurality of wiring patterns alternately laminated via an insulating layer; a chip mounting area for mounting the semiconductor chip 3, and a chip mounting area 5 including the former chip mounting area slightly larger than the former chip mounting area, on one surface; and a plurality of BGA pads which are connected to sets of wiring patterns in an inner part, and to which a signal line and a power-ground line are connected in an outer part, on the other surface. Not the signal line but the power-ground line is connected to the BGA pads 7 positioned in an area corresponding to the chip mounting area on the other surface. The signal line is connected to the BGA pads 6 positioned in an area corresponding to the outer area of the chip mounting area on the other surface. COPYRIGHT: (C)2008,JPO&INPIT
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