发明名称 モノリシック集積回路の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a technique for improving reverse recovery characteristics of a diode. <P>SOLUTION: A monolithic integrated circuit 100 includes a semiconductor layer 6, an insulation separation part 4, and a diode 6. The insulation separation part 4 insulates an island region 8 as a part of the semiconductor layer 6 from a periphery when viewed in plan view. The diode 16 is formed in the island region 8. The diode 16 has a center region 14 of a first conductivity type and an annular region 10 of a second conductivity type. The center region 14 and the annular region 10 are formed in a surface layer of the semiconductor layer 6. The annular region 10 makes one round around the center region 14 when viewed in plan view. A through part 18 penetrating the semiconductor layer 6 is formed in the island region 8. The through part 18 is surrounded with the center region 14. The monolithic integrated circuit 100 has a trench defining the insulation separation part 4, and a trench defining the through part 18, formed in the same manufacturing process. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5922379(B2) 申请公布日期 2016.05.24
申请号 JP20110257372 申请日期 2011.11.25
申请人 株式会社豊田中央研究所;株式会社デンソー 发明人 鈴木 隆司;戸倉 規仁;白木 聡;高橋 茂樹;芦田 洋一;櫻井 晋也
分类号 H01L29/861;H01L21/329;H01L21/8234;H01L27/06;H01L29/06;H01L29/868 主分类号 H01L29/861
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