PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST

摘要

The present invention relates to a resin composition having photocurable and thermosetting properties, and to a dry film solder resist manufactured therefrom. The resin composition comprises: an acid modified oligomer including an iminocarbonate-based compound having a carboxylic group and a photocurable unsaturated functional group; a photocurable monomer having at least two photocurable unsaturated functional groups; a thermocurable binder having a thermocurable functional group; a photoinitiator; and a blue pigment. The dry film type solder resist secures excellent workability based on high legibility and hiding properties, and has a low thermal expansion coefficient and enhanced reliability of thermal resistance through high efficiency of photocuring.