Chipkondensator und Verfahren zur Herstellung.

摘要

In a chip type capacitor, the capacitor is accommodated in a sheathing frame 2 having the receiving space compatible with the external dimensions of the capacitor. Terminals 3 which extend from the open end frame 2 are bent along the top surface of the frame 2 and a solderable metal layer e.g. 7 is arranged in a part of the top surface thereof, to facilitate soldering to a circuit board.