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发明名称
Verfahren zum Aufbringen einer haftfesten Kupferschicht auf duennen Isolierfolien
摘要
申请公布号
DE1690025(A1)
申请公布日期
1971.04.15
申请号
DE1967S111283
申请日期
1967.08.09
申请人
SIEMENS AG
发明人
BECKMANN,KLAUS
分类号
C23C18/20;C23C18/40;H05K3/18;H05K3/38
主分类号
C23C18/20
代理机构
代理人
主权项
地址
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