| 摘要 |
PURPOSE:To reduce flaws and haze on the specular finished surface of a semiconductor wafer and to extend the life of a device. CONSTITUTION:A bonding plate 9, which has a semiconductor wafer 10 bonded thereto and is mounted on a mounting portion 8, is directly pressurized and supported by means of a pivot 7 with a load applied to a single point at its center, and a handle 15 is mounted on the mounting portion 8 of the bonding plate 9 via a bearing 16. The bonding plate 9 is supplied onto and taken out from a surface plate 4 by using a takeout hand 11 to support the handle 15, and the takeout of the bonding plate 9 can be achieved without stopping rotation of the bonding plate by means of the bearing 16. A bearing 12 is built into the tip of the pivot 7. |
