发明名称 Randklemme.
摘要 An edge clip for attachment to a contact pad on a micro circuit substrate includes a pair of spaced apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and folded end portions, aligned with the connecting portion, can be supported from carrier rails et both ends during manufacture.
申请公布号 DE3587827(T2) 申请公布日期 1994.10.20
申请号 DE19853587827T 申请日期 1985.01.10
申请人 NORTH AMERICAN SPECIALITIES CORP., FLUSHING, N.Y., US 发明人 SEIDLER, JACK, FLUSHING NEW YORK 11354, US
分类号 H01R4/02;H01R12/57;H05K3/34;H05K3/36 主分类号 H01R4/02
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