发明名称 |
Randklemme. |
摘要 |
An edge clip for attachment to a contact pad on a micro circuit substrate includes a pair of spaced apart spring fingers, adapted to receive the edge of the substrate therebetween. One or both of the fingers may at least partially encircle and support a mass of solder. The fingers are joined to the body portion with a folded connecting portion integral with the body between its ends, and folded end portions, aligned with the connecting portion, can be supported from carrier rails et both ends during manufacture. |
申请公布号 |
DE3587827(T2) |
申请公布日期 |
1994.10.20 |
申请号 |
DE19853587827T |
申请日期 |
1985.01.10 |
申请人 |
NORTH AMERICAN SPECIALITIES CORP., FLUSHING, N.Y., US |
发明人 |
SEIDLER, JACK, FLUSHING NEW YORK 11354, US |
分类号 |
H01R4/02;H01R12/57;H05K3/34;H05K3/36 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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