| 摘要 |
PURPOSE:To reduce the time and cost required for reliable connections of semiconductor devices when pitches of inner leads and terminals are narrowed as compared with that in the case of a wire bonding method when a terminal of a wiring circuit of a circuit board is electrically connected to inner leads as an external terminal. CONSTITUTION:Inner leads 7a of leads 7 are connected to terminals 3a of a wiring circuit 3 via conductive paste 10 in a circuit board having a circuit board 4 which has semiconductor placing units 9a-9d and the circuit 3 and the leads 7 connected to the terminals 3 of the circuit 3 as an external terminal. Particularly, the leads 7a are bent toward the terminal 3a, brought into contact with the terminal 3a, and the contact part is preferably embedded in the paste 10. |
