| 摘要 |
PURPOSE:To connect an inner-layer wiring and an outer-layer wiring without forming a non-through hole after lamination and to eliminate further control of flow behavior of an adhesive if an inner-layer circuit is fully filled with an adhesive by providing a conductive protrusion which can be housed in the hole of an outer-layer substrate at the wiring of an inner-layer circuit board. CONSTITUTION:An adhesive layer of B stage is provided on the surface at the insulation material side of a single-surface copperclad lamination plate and then a hole is provided on the substrate. Also, the wiring of an inner-layer circuit board which is subjected to lamination adhesion to the substrate with a hole via an adhesive is formed and then a conductive protrusion with a size for housing a hole is provided at a part corresponding to the position of the hole of the substrate with a hole. Then, after the substrate with a hole and the inner-layer circuit board are subjected to lamination adhesion via the adhesive layer, a conductor is formed at a needed part of a plate which is subjected to lamination adhesion, and then a conductor circuit at least on the substrate with a hole and the wiring of the inner-layer circuit are connected at the part of a hole. A copper foil for printed wiring board may be used instead of the single surface copper-clad lamination plate. |
