发明名称 POLYAMIDE RESIN COMPOSITION AND COMPOSITE MOLDED ARTICLE
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition capable of directly adhering to a chlorine-containing resin (for example, a vinyl chloride resin, etc.). <P>SOLUTION: The resin composition is composed of a polyamide based resin, and an alicyclic tertiary amines (1,4-diazabicyclo[2.2.2]octane, 1,8-diazabicyclo[5.4.0]undecene-7, and 1,5-diazabicyclo[4.3.0]-nonene-5 and salts thereof, etc.). The resin composition can comprise 0.001-5 pts.wt. of the alicyclic tertiary amines per 100 pts.wt. of the polyamide based resin. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008222930(A) 申请公布日期 2008.09.25
申请号 JP20070065464 申请日期 2007.03.14
申请人 DAICEL-EVONIK LTD 发明人 ARITA HIROAKI
分类号 C08L77/00;B32B27/34;C08J5/12;C08K5/34;H01B7/17 主分类号 C08L77/00
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