发明名称 |
Semiconductor device and semiconductor package. |
摘要 |
A semiconductor device includes a system-on-chip (SOC) and at least one wide input/output memory device. The SOC includes a plurality of SOC bump groups which provide input/output channels, respectively, independent from each other. The at least one wide input/output memory device is stacked on the system-on-chip to transmit/receive data to/from the system-on-chip through the SOC bump groups. The SOC bump groups are arranged and the at least one wide input/output memory device is configured such that one of the wide input/output memory devices can be mounted to the SOC as connected to all of the SOC bump groups, or such that two wide input/output memory devices can be mounted to the SOC with each of the wide input/out memory devices connected a respective half of the SOC bump groups. |
申请公布号 |
NL2012389(B1) |
申请公布日期 |
2016.07.15 |
申请号 |
NL20142012389 |
申请日期 |
2014.03.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
TAE SUN KIM;KYOUNG MOOK LIM |
分类号 |
H01L25/065;H01L25/18 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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