| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus capable of mounting a treatment target at an optimal position atop a mounting base and of minimizing the contact area of the treatment target and another component during a treatment process.SOLUTION: In the provided heat treatment apparatus 1 for executing a carburizing treatment and/or hardening treatment of a circular treatment target W, a treatment chamber 2 in which the treatment target W is subjected to a specified treatment, a conveyance mechanism 3 for conveying the treatment target W into and out of the treatment chamber, and a mounting base 4 configured within the treatment chamber for mounting the treatment target W conveyed into the treatment chamber are configured; a conveyance arm 10 for mobilizing the treatment target W being mounted on the conveyance mechanism 3 is also configured; at least three support pins 12 for conveyance for supporting the treatment target W at the time of the conveyance of the treatment target W are configured on the conveyance arm 10; and at least three mounting base support pins 9 for supporting the treatment target W are configured on the mounting base 4. |
