| 摘要 |
PURPOSE:To suppress generation of a leakage current between bump electrodes and prevent the leakage current from running in the DC input and output parts of a semiconductor device. CONSTITUTION:The semiconductor device is formed by providing at least a photosensitive polyimide insulation film 4, which has an opening part 4a with conductive film 2 exposed, on the conductive film 2, forming a bump electrode 6 in contact with the conductive film 2 in the opening part 4a, and preparing a separation groove 4b to allow the bump electrodes 6 to be separated from each other on the insulation film 4 between the bump electrodes 6. |
