| 摘要 |
PURPOSE:To prevent a wire from being exposed out of a thin package resin by a method wherein the center region of a die pad is set smaller in thickness than a lead and a stay, and a cutout is provided to the rear peripheral part of the die pad. CONSTITUTION:A lead frame 2 is equipped with a die pad 4, leads 6 extending outwards, and a stay. The center region of the die pad 4 is set smaller in thickness than the leads 6 and the stay by half-etching or stamping the rear center of the die pad 4. Furthermore, a cutout K is provided to a part of the rear peripheral part 4a of the die pad 4 by half-etching, stamping, or grinding. By this setup, a wire can be effectively prevented from being exposed out, of a thin-type package resin.
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