BUMP, MANUFACTURE THEREOF, AND METHOD OF MOUNTING OPTICAL DEVICE

摘要

PURPOSE:To mount optical devices on a circuit board without a tilt by using bumps cut from a material that has a tubular coaxial structure comprising solder with a core of a higher melting point than solder. CONSTITUTION:A material for bumps has a tubular coaxial structure comprising solder 5 with a core 6 having a higher melting point than solder, or it is a solder-coated metal wire having a higher melting point than solder. The material is cut into bumps 4 of desired length. Bumps are used to mount optical devices on a circuit board; that is, they are fixed to electrodes 1a on a board 1, an optical device 3 is placed on the board, the solder 5 of the bumps 4 are melted by heat, and the optical device is pressed perpendicularly against the board. One example of this material is a copper wire coated with AuSn solder.