| 摘要 |
<p>PURPOSE:To restrain a semiconductor chip from becoming large and to achieve more pins by a method wherein pads are not arranged along the periphery of the semiconductor chip but their arrangement is contrived. CONSTITUTION:Two rows of pads 12 are formed on the diagonal line of a semiconductor chip 11, and leads 14 whose pitch is the same as the formation pitch of the two rows of pads and which are fixed to an insulating film are connected by wires 15. The leads protrude from an opening part, in the insulating film, which is opened along the diagonal line of the semiconductor chip, and they are drawn out to the direction of sides of the semiconductor chip.</p> |
