| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high-performance inductor for an IC device that can be manufactured more easily. SOLUTION: After non-flush micro-coils (for example, inductors) 200, containing conductive traces are formed on a substrate 210, the traces are connected to each other by using a standard wire bonding technique. The conductive trace of each microcoil 200 contains first and second connection pads 237 and 252 provided at an interval and interconnecting wiring 240, which is extended long between the pads 237 and 252. Then a first wire 260 (1) is provided, so that the wire 260 (1) is extended from the first pad 237 to the first end section of the wiring 240 on the surface of the substrate 210. In addition, a second wire 260 (2) is provided, so that the wire 260 (2) is extended from the second pad 252 to the second end section of the wiring 240 on the surface of the substrate 210. |
