摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for joining electronic components having an electrode which has superior bonding strength between the electroless Ni-plated layer and Pb-free solder, and of which the Ni-plated layer is not melted even by repetitive re-flow. SOLUTION: The method for joining electronic components is characterized by forming the first metal layer of electroless plated nickel and the second metal layer of electroless plated gold on the first metal layer, on the electrode, and giving the second metal layer the thickness of 0.005μm-0.04μm, when joining an electronic component on the electrode of another electronic component, through the lead-free solder layer.</p> |