发明名称 METHOD FOR JOINING ELECTRONIC COMPONENTS
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for joining electronic components having an electrode which has superior bonding strength between the electroless Ni-plated layer and Pb-free solder, and of which the Ni-plated layer is not melted even by repetitive re-flow. SOLUTION: The method for joining electronic components is characterized by forming the first metal layer of electroless plated nickel and the second metal layer of electroless plated gold on the first metal layer, on the electrode, and giving the second metal layer the thickness of 0.005μm-0.04μm, when joining an electronic component on the electrode of another electronic component, through the lead-free solder layer.</p>
申请公布号 JP2002327279(A) 申请公布日期 2002.11.15
申请号 JP20010135607 申请日期 2001.05.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 HIRANO JUNYA
分类号 C23C18/52;C23C18/18;H01L21/60;(IPC1-7):C23C18/52 主分类号 C23C18/52
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