发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide a thin film capacitor, which can reduce a leak current and increase a capacity. SOLUTION: An upper electrode 3 and lower electrode 1 are made of at least one material chosen from metal nitrides of TiN, Ti, W, WN, Pt, Ir, and Ru. A capacitance insulation film 2 is made of at least one material chosen from ZrO2, HfO2, (Zrx, Hf1-x)O2 (0<x<1), (Zry, Ti1-y)O2 (0<y<1), (Hfz, Ti1-z)O2 (0<z<1), or (Zrk, Til, Hfm)O2 (0<k, l, m<1 and k+l+m=1) formed by the Atomic Layer Deposition (hereinafter, ALD) method. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006270123(A) 申请公布日期 2006.10.05
申请号 JP20060168755 申请日期 2006.06.19
申请人 NEC ELECTRONICS CORP 发明人 IIZUKA TOSHIHIRO;YAMAMOTO ASAE;TODA ASAMI;YAMAMICHI SHINTARO
分类号 H01L21/8242;H01L21/316;H01L21/822;H01L27/04;H01L27/108 主分类号 H01L21/8242
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