| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging apparatus with a structure whereby heat generated from an electronic circuit for carrying out image processing can be dissipated without the need for increasing the height of the outward shape. SOLUTION: The imaging apparatus 1a includes: a prism unit 10; an imaging element 21; a semiconductor element 22; a board 23; a case 25; and a dissipation unit 30a. The imaging element 21 is located on an imaging face of the prism unit 10. The semiconductor element 22 captures a signal obtained by the imaging element 21 to carry out processing of converting the signal into image data. The imaging element 21 and the semiconductor element 22 are mounted on the board 23. The case 25 houses the prism unit 10 except its incident window 25a and its image forming face along the outer shape of a rectangle form. The dissipation unit 30a is formed to be a series from a heat receiving section 31 to a heat dissipation section 32. The heat receiving section 31 is in contact with the side of the board 23 opposite to the mount side of the semiconductor element 22. The heat dissipation section 32 is arranged along the outer face of the case 25. COPYRIGHT: (C)2007,JPO&INPIT
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