| 摘要 |
The present invention relates to a halogen-free thermosetting resin composition, a prepreg using the same, and a lamination plate for printed circuit. The halogen-free thermosetting resin composition includes: (A) 30-60 parts by weight of a halogen-free epoxy resin, (B) 20-50 parts by weight of a compound having a dihydro benzoxazine ring (C) 10-40 parts by weight of a phosphorus-containing bisphenol hardening agent, with respect to 100 parts by weight of organic solid. The prepreg and the lamination plate for printed circuit which are produced by the halogen-free thermosetting resin composition of the present invention show high glass transition temperature, excellent dielectric performance, low absorption rate, high heat resistance, and favorable processability, and ensures halogen-free flame retardance while flame retarding level reaches the level of UL94 V-0. |
