Halbleiterbauelement und Verfahren zu seiner Herstellung,申请号DE19691947067-传众专利搜索

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发明名称	Halbleiterbauelement und Verfahren zu seiner Herstellung
摘要
申请公布号	DE1947067(A1)	申请公布日期	1970.04.09
申请号	DE19691947067	申请日期	1969.09.17
申请人	SONY CORP.	发明人	WAKAMIYA,KINJI
分类号	H01L21/00;H01L21/225;H01L21/329;H01L23/29;H01L23/485	主分类号	H01L21/00
代理机构		代理人
主权项
地址

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