| 摘要 |
PURPOSE:To manufacture cheaply and easily the title device or member by covering the surface of platinum with metal contg. above a specified amt. of Ni at a specified thickness to minimize consumption of platinum due to oxidation evaporation in high temp. use. CONSTITUTION:The surface of a formed device or member made of platinum is covered with metal contg. above 10% Ni to a thickness of 2-500 mu by electroplating, chemical reduction plating, vacuum deposition, sputtering or metallizing. As the metal contg. above 10% Ni, Ni metal or an alloy of Ni and a platinum group metal is used. When the device or member covered by this method is used at high temp. in an oxygen-contg. atmosphere, an oxide layer of the Ni-contg. metal is formed to prevent consumption of the device or member surface. |
