| 摘要 |
PURPOSE: To provide an integrated circuit which has reinforced leads, capable of preventing bending by increasing stiffness and of improving alignment and stability of position. CONSTITUTION: A plurality of leads 202 are led out, spaced at predetermined intervals from sides of a plastic IC package body 200, and spaces between the adjacent leads 202 are molded with a plastic 204 at their predetermined positions, whereby the plastic 204 holds the leads 202. As a result, since the stiffness of the leads 202 is increased, bending of the leads 202 is prevented. |
