METHOD AND APPARATUS OF MOUNTING A LENS

摘要

A rear surface emission type light emitting diode emits light beams produced at a narrow emanating region out of the rear surface of the substrate. Preferably a device chip should be directly equipped with a lens on its rear surface. A plurality of light emitting devices with a package are laid on an XY-stage (12,13) which can move in an XY-plane. A camera (2), a dispenser (3) and a vacuum collet (4) can translate in Z-direction. The distances and the directions among the camera, the dispenser and the collet are predetermined values. The chip is actually examined by letting it emit light beams from the emanating region. The light is observed by the camera (2) to obtain light power distribution on individual pixels. From the light power, the center of the emanating region is determined. The XY-stage (12,13) is displaced till the center of the emanating region coincides with the center of the camera. Then the XY-stage is moved by the predetermined distance to send the chip just beneath the dispenser (3). The dispenser comes into contact with the chip and supplies ultraviolet resin to the chip. The XY-stage is again displaced by the predetermined distance to locate the chip below the vacuum collet (4) holding a lens. The collet lowers the lens towards the resin on the surface till the lens touches the surface. Ultraviolet rays are emitted onto the ultraviolet hardening resin to stiffen the resin.