| 摘要 |
The adhesive, which contains a curable oxazene resin containing at least one 1-oxa-3-azatetralin group in the molecule, optionally in combination with at least one curable epoxy compound, is used to bond polyimide films to similar films or other substrates, in particular metal foils. Adhesive bonds of this type are suitable for the production of circuit boards, in particular flexible circuit boards, of high heat resistance and peel strength. |
