| 摘要 |
PROBLEM TO BE SOLVED: To provide a fixed carrier in which the risk of falling reliability with regard to iterative use due to intrusion of grinding fluid, and the risk of contamination can be eliminated as occurred due to adhesion of grinding fluid to the peripheral device of a semiconductor wafer. SOLUTION: The fixed carrier comprises a substrate 21 set on a back grinder rotatably; a recess 22 formed in the surface of the substrate 21; a plurality of supporting protrusions 24 arranged in the recess 22; a deformable adhesion layer 25 supported by the plurality of supporting protrusions 24 while covering the recess 22, and adhesively holding a semiconductor wafer W removably; a supply/discharge channel 26 bored in the substrate 21, and introducing the air in the recess 22 covered with the adhesion layer 25 to the outside upon driving a vacuum pump 27; and a ventilation waterproofing film 30 for preventing intrusion of grinding fluid of the back grinder into the supply/discharge channel 26. Since the ventilation waterproofing film 30 covers the supply/discharge channel 26 communicating with the recess 22 to intercept the grinding fluid, the grinding fluid is prevented from intruding into the fixed carrier 20 to decrease reliability for iterative use. COPYRIGHT: (C)2007,JPO&INPIT |
