发明名称 CUTTING EQUIPMENT OF SUBSTRATE AND METHOD FOR CUTTING OF SUBSTRATE USING THE SAME
摘要 <p>An apparatus for cutting a substrate includes first and second belt conveyers for conveying the substrate thereon, a scriber for scribing the substrate along a cutting-reserved line, the scriber provided between the first and second belt conveyers and being spaced apart from the first and second belt conveyers, and a substrate support for securing the substrate, the substrate support provided between the first and second belt conveyers along a scribing direction of the substrate.</p>
申请公布号 KR20060074209(A) 申请公布日期 2006.07.03
申请号 KR20040112867 申请日期 2004.12.27
申请人 LG.PHILIPS LCD CO., LTD. 发明人 KIM, JUNG SIK
分类号 G02F1/13 主分类号 G02F1/13
代理机构 代理人
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