| 摘要 |
PURPOSE:To enable the titled device small-sized and resin-sealed corresponding to high density automatic mounting to be manufactured at a low cost by a method wherein outer leads are bent prior to package sealing. CONSTITUTION:The outer leads are bent prior to sealing. For example, an element-mounting section 2 and lead sections 12' are formed in a thin metallic plate 1 by press working in order to form a lead frame used for the semiconductor device small-sized and resin-sealed having the casual arrangement of leads and lead-molded. Further, the lead frame is molded to the demanded shape and dimension of leads of the device and treated by plating. Thereby, the lead molding dimensional accuracy of the device after resin sealing improves, and lead molding is not carried out after resin sealing; therefore, the density strength between the resin and the leads is not damaged, and the moisture resistance improves. |
