| 摘要 |
PROBLEM TO BE SOLVED: To reduce weight by forming an insulating resin on a surface with an electrode formed of an insulating substrate, and forming a conductive resin on the insulating resin so as to seal coated wires exposed on the insulating resin, while the insulating substrate is removed to expose the electrodes. SOLUTION: Coated wires 18 are wire-bonded between predetermined bump- bonding pads 16 and external connection pads 17 which are formed on an insulating substrate 21. Subsequently, insulating resin 20 is formed on the insulating substrate 21, and a conductive resin 22 is formed on the insulating resin so as to fully cover the wires 18 exposed from the insulating substrate 21. Then, a treatment such as laser machining, etching or the like for removing the insulating substrate 21 is done to expose each pad 16, 17. Thereby, it is possible to deal with terminal-count increase associated with high densification of semiconductor devices, while reducing the weight. |
