| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board in which noble metal plating of uniform thickness can be applied to a required part of a printed circuit board by electroplating without using outer lead wire. SOLUTION: Prior to a plating process, a temporary ground circuit for plating which short-circuits all leads leading to a circuit element being plated temporarily to the ground part is formed by applying a conductive substance, power is fed to the circuit element being plated from a metal substrate through the ground part and the temporary ground circuit for plating in a plating bath, noble metal plating is applied and the conductive substance constituting the temporary ground circuit for plating is removed upon completion of plating. |
