| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of mounting a decoupling capacitor at the shortest distance close to a semiconductor integrated-circuit chip without using any interposer structure. SOLUTION: The semiconductor device comprises a supporting substrate 1, a semiconductor integrated-circuit chip 2 mounted on the supporting substrate, and a capacitor 20 that allows the semiconductor integrated-circuit chip to perform stable operation at high frequency regions, wherein the semiconductor integrated-circuit chip 2 and a leadframe 16 are electrically connected by wire-bonding. The capacitor 20 is electrically connected to electrode pads formed on the upper surface of the semiconductor integrated-circuit chip 2, while the height of the capacitor 20 on the upper surface of the semiconductor integrated-circuit chip 2 including the substrate is lower than the height of the bonding wires. COPYRIGHT: (C)2007,JPO&INPIT |
