| 摘要 |
An image-capturing device 1 is provided with an image-capturing element 10 in which a plurality of electrode pads 13 are juxtaposed on an inclined plane 10SS, a wiring board 40 on which a plurality of first junction electrodes 44 joined to each of the plurality of electrode pads 13 via solder bumps 54 are juxtaposed at a first end portion 40S1 and a plurality of second junction electrodes 46 are juxtaposed at a second end portion 40S2, and a signal cable 50 joined to each of the plurality of second junction electrodes 46 via solder bumps 56, wherein the wiring board 40 has a first protective film 42 covering the first end portion 40S1 and a second protective film 43 covering the second end portion 40S2, the second protective film 43 having a thickness greater than the thickness of the first protective film 42 and the height of the second solder bumps 56. |
