发明名称 Surface acoustic wave device including first and second wiring electrodes crossing three-dimensionally
摘要 A surface acoustic wave device includes, on a substrate, functional electrode units each including at least one IDT electrode, wiring electrodes connected to the functional electrode units, insulation films provided between the wiring electrode and the substrate, and a support member that surrounds the functional electrode units and at least a portion of the wiring electrodes. A thickness of the support member is larger than a thickness of the insulation films, and the insulation films and the support member are made of the same material.
申请公布号 US9444427(B2) 申请公布日期 2016.09.13
申请号 US201514882511 申请日期 2015.10.14
申请人 Murata Manufacturing Co., Ltd. 发明人 Tsuda Motoji
分类号 H03H9/10;H03H9/64;H03H9/02;H03H9/05;H03H9/145;H03H9/25 主分类号 H03H9/10
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A surface acoustic wave device comprising: a substrate; a functional electrode unit located on the substrate and including at least one interdigital transducer (IDT) electrode; a wiring electrode that is connected to the functional electrode unit and is located on the substrate; an insulation film that is provided between a portion of the wiring electrode and the substrate; a support member that is provided on the substrate and surrounds the functional electrode unit and at least a portion of the wiring electrode; and a cover member that defines, along with the support member, a hollow space in which the functional electrode unit is located; wherein a thickness of the support member is larger than a thickness of the insulation film, and the insulation film and the support member are made of the same material; the wiring electrode includes a first wiring electrode and a second wiring electrode; a three-dimensional crossing section where the first wiring electrode and the second wiring electrode cross each other in a three-dimensional manner is provided; the support member is present above at least a portion of the second wiring electrode in the three-dimensional crossing section; the insulation film is located under the second wiring electrode in the three-dimensional crossing section; and the first wiring electrode is located under the insulation film.
地址 Kyoto JP