EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

摘要

PURPOSE:An epoxy resin composition, containing polypropylene powder and useful as a resin having high water resistance and low stress at the same time for sealing semiconductors. CONSTITUTION:An epoxy resin composition obtained by blending 1-20pts.wt. polypropylene powder with 100pts.wt. epoxy resin. The polypropylene powder to be used has >=140 deg.C melting point. 250-500pts.wt. inorganic filler and 20-100 pts.wt. curing agent having phenolic hydroxyl groups are further blended to give the aimed composition. The polypropylene powder has preferably the melting point about equal to or higher than the molding temperature or after-curing temperature. Novolak type resin is preferably used as the epoxy resin and silica is preferably used as the filler. Phenolic novolak is preferred for the curing agent.