| 摘要 |
PROBLEM TO BE SOLVED: To easily realize bending to a thick-side by making a conductor layer to be thicker than respective resin insulating layers on both faces and making the insulating layer on the outer-side to be thinner by making the ratio of the thickness of the insulating layer on the bending outerside and that of the insulating layer on the inner-side to be a specified one. SOLUTION: The thickness of the conductor layer is set to be thicker than the resin insulating layers on both faces, and the insulating layer on the outer- side is set to be thinner in such a way that the ratio of the thickness of the insulating layer on the bending outer-side and the insulating layer on the inner- side becomes 1:1.1-to 3.0, desirably to be 1:1.8-2.2. Namely, the thickness of a circuit conductive layer 2 is set to be 35μm with the thickness of the inner insulating layer 1 of bending as 18μm and the thickness of the outer insulating layer 3 of bending to be 9μm. Such FPC can stably be bent only by adding slight force in an upper direction with an intermediate point and an R-point in the longitudinal direction of the inner-side insulating layer 1 as fulcrums.
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