发明名称 Fuse structure
摘要 A metal layer structure is disclosed. The metal layer structure includes a substrate, a first dielectric layer on a surface of the substrate, and at least one first conductor and at least one second conductor on the first dielectric layer. The second conductor has at least one thin portion.
申请公布号 US7301216(B2) 申请公布日期 2007.11.27
申请号 US20040711790 申请日期 2004.10.05
申请人 UNITED MICROELECTRONICS CORP. 发明人 LEE CHIU-TE;WU TE-YUAN
分类号 H01L29/00;H01L21/60;H01L23/525 主分类号 H01L29/00
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