LIGHT EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A light emitting diode package and a manufacturing method thereof are provided to minimize deviation of a color coordinate by directly mounting a LED chip on a phosphor substrate. A LED chip(120) is mounted on a phosphor substrate(110). A circuit substrate(130) is mounted on the phosphor substrate of a region except for a region on which the LED chip is mounted. An electrode connection part(140) connects the LED chip to the circuit substrate. An encapsulant(150) covers the LED chip, the circuit substrate, and the phosphor substrate. The phosphor substrate is a substrate containing a phosphor inside a glass substrate. The electrode connection part is composed of a wire.