Mechanisms for wafer cleaning

摘要

Embodiments that relate to mechanisms for cleaning wafers is provided. A method for wafer cleaning includes cleaning wafers by a wet-bench cleaning operation. The method also includes thereafter cleaning each of the wafers by a single-wafer cleaning operation. In addition, a cleaning apparatus for enhancing the performance of the above method is also provided.

主权项

1. An apparatus for wafer cleaning, comprising:
a chamber; a wet-bench cleaning device within the chamber, wherein the wet-bench cleaning device comprises a lifter associated with a tank; a plurality of single-wafer cleaning devices within the chamber and adjacent to the wet-bench cleaning device, wherein the wet-bench cleaning device is between the single-wafer cleaning devices, and each of the single-wafer cleaning devices comprises a dispenser over a wafer-positioning element; and a controller, configured and programmed to control priority and delay time of transferring wafers to be cleaned between the wet-bench cleaning device and the plurality of single-wafer cleaning devices, wherein the lifter comprises a wafer holder configured to hold wafers in a horizontal direction, the wafer holder including two vertical sidewalls, each of the two vertical sidewalls having a plurality of dividers and a plurality of grooves thereon, each of the grooves being located between two immediately adjacent dividers, and wherein the wafer holder further includes a plurality of pipe, each of the pipes extending through a corresponding one of the two vertical sidewalls and splitting into two paths in a corresponding one of the dividers, the two paths respectively extending through the corresponding one of the dividers at two different surfaces of the corresponding one of the dividers, the two different surfaces of the corresponding one of the divider being respectively located at two different grooves.