| 摘要 |
The present invention relates to an LED fluorescent lamp having no heat dissipation plate using far-infrared radiation. A circuit is formed by delaminating copper thin films on both sides of a non-metal double-sided PCB substrate. The area of a copper thin film where LEDs are installed in series is maximized. The circuit component is installed at the edge of the PCB. A connection circuit is formed on the surface of a substrate where the LEDs are not installed. A superior heat dissipation effect can be obtained by using infrared radiation rate even through the heat dissipation plate are not attached. The LED fluorescent lamp includes a tube, a PCB, a socket, and a warpage preventing member. |
