| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic device, enabling mixing of a different kinds of resin materials to be suppressed.SOLUTION: The method for manufacturing an electronic device includes a resin sealing step of molding a mold resin containing a first resin portion 41 and a second resin portion 42. The resin sealing step includes: arranging in a cavity of a die for a compression mold a frame member 440 for dividing the cavity into a plurality of regions; and applying each of resin materials 41 and 42 held in an applicator to the cavity which has the frame member 440 arranged therein and is divided into the plurality of regions. In the resin sealing step, the frame member 440 is take out from the cavity after application of each of the resin materials 41 and 42, and compression molding is performed.SELECTED DRAWING: Figure 18 |
