| 摘要 |
PURPOSE: To transfer heat efficiently in various types by bonding a heat spreader having high thermal conductivity with the top face of a bonding pad for a semiconductor chip and sealing the semiconductor chip by a metallic cap stuck fast onto the top face of the heat spreader. CONSTITUTION: A semiconductor chip 74 is mounted on a die pad 73 for a mounting substrate 71, and bonding pads for the chip 74 and the substrate 71 are connected electrically by bonding wires 75. The internal regions of the bonding pads are coated with adhesives 76 on the top face of the chip 74. Fillers having high thermal conductivity are used as the adhesives 76 at that time. A heat spreader 77 formed of copper, etc., having high thermal conductivity is loaded on the adhesives 76. When a thermal compound 78 is dotted between the heat spreader 77 and a cap 79, the mounting substrate 71 and the metal cap 79 are hermetically sealed with a sealing compound 72, and the thermal compound 78 is also cured at the time of the curing of the thermal compound. Accordingly, a high thermal emissive semiconductor package can be manufactured. |
