| 摘要 |
1529857 Semiconductor devices GENERAL ELECTRIC CO 13 Nov 1975 [13 Nov 1974] 46841/75 Heading H1K Contact to a semiconductor body 22 (Fig. 3) is effected via a metal plate 31A preclad with a solder layer. The plate 31A and the solder layer thereon are coextensive with an electrode 24 on the body surface, and following alignment employing a shaker alignment technique using jigs for the body 22 and plate 31A, bonding is effected by a heating step. The plate 31A may, as shown, be solder clad on both faces to facilitate subsequent attachment, e.g. to a header, and a similar plate 31B may be provided at the opposite surface of the body 22, In this case the solder cladding for the second-applied plate preferably has a lower melting point than that for the first-applied plate. Fig. 8 shows a wafer 67 comprising a plurality of separate device pellets 68 each of which is provided with a separate solder-clad metal plate by use of appropriate jigs as shown. An upper jig may be provided to simultaneously locate solderclad plates on the opposite wafer surface, or the assembly may be turned upside-down in the illustrated jig to allow the plates to be secured to the opposite surface. |
