| 摘要 |
<p>PURPOSE:To prevent the occurrence of the warpage, deflection, and lateral shifting of a wiring board by performing screen-printing of solder paste, mounting of surface mounted parts, and solder fusion connection by a solder reflow method after the wiring board is fixed to a carrying carrier with a heat resistant double-sided adhesive tape. CONSTITUTION:To a carrying carrier composed of a plate 1 provided with projections 2 at prescribed positions wiring boards 3 made of glass cloth epoxy are fixed with heat resistant double-sided adhesive tapes 4. Then, after applying solder paste 5 to prescribed positions of the boards 3 by screen-printing, flat package ICs 6, chip capacitors 7, etc., are mounted on the boards 3 and fixed to the boards by solder fusion connection of reflow soldering. After fixing the ICs 6, chip capacitors 7, etc., to the boards 3, the boards 3 are taken out from the carrier and electronic circuit modules are completed. Since the wiring boards 3 are fixed to the plate 1 of the carrier with the double-sided adhesive tapes 4 in such way, no lateral shifting takes plate at the boards 3 due to warpage or deflection.</p> |
