| 摘要 |
<p>PURPOSE:To avoid the damage to wafers and the dust adhering thereto by a method wherein wafers are positioned making use of the picked-up picture images by cameras without resorting to a mechanical device such as a pin, etc. CONSTITUTION:A camera 22 is arranged on the position opposite to a wafer cassette 21 containing wafers before they are processed while another camera 24 is arranged on the position opposite to another wafer cassette 23 supposed to contain wafers after they are processed. At this time, the coordinate value of reference position in positioning the wafer is previously stored to decide the wafer compensation data by these reference data and the wafer picked-up picture image data so that the wafer may be positioned according to the compensation data. Accordingly, the wafer can be positioned without coming into contact therewith. Through these procedures, the wafer can accurately be positioned neither doing damage nor letting the dust adhere thereto.</p> |
