| 摘要 |
<p>The invention automatically inspects the bond of a wire to a contact pad on a semiconductor chip. The apparatus includes a movable platform (03) for holding semiconductor chips (20) situated in leadframes (10); a video camera (04) for sensing images; illumination means (05) for illuminating a chip (20) in a lead frame (10); an image processor (06) to digitize and analyze the images; a bonding mechanism (07); and a host controller (08) electronically connected to bonding mechanism (07), movable platform (03), video camera (04) and image processor (06). Image processor (06) locates a bond on a pad in a digitized image and provides a first nominal center of ball bond image. The invention utilizes a polar coordinate transform image to evaluate the ball bond image by creating a polar projection histogram array. A peak in the histogram array is then dectected. The peak gives an indication of the size and position of the bond.</p> |
