| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package for piezoelectric element storage which is superior in mounting and which can ensure lightweightness and compactness of package and can secure electrical reliability of a piezoelectric element, and to provide a manufacturing method therefor. SOLUTION: In a ceramic package 10 for piezoelectric element storage where the center portion of a main surface of one side of a ceramic substrate 13, to which a window frame like frame body 12 constituted of ceramic, metal, or the like, is integrated with a flat plate ceramic substrate 11 or an external peripheral portion of its main surface of one side has a pair of connection conductor pads 15 constituted of high melting point metal to join an electrode terminal of one end portion side, in the longitudinal direction of a piezoelectric element 14; the upper surface of the connection conductor pad 15 has a flat surface 17, which is parallel and projects by 0.03 mm from the one main surface of the ceramic substrate 11 other than the substrate where the connection conductor pad 15 is formed in a cross-section view; and an end edge of the flat surface 17 lies within 0.15 mm from the end edge of the ceramic substrate 11 of the connection conductor pad 15, as seen in a planar view. COPYRIGHT: (C)2009,JPO&INPIT
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