Thermal spreading for an externally pluggable electronic module

摘要

A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.

主权项

1. A method for assembling a cooling apparatus for dissipating heat from a heat-producing electronic module, the method comprising:
attaching an electrically insulative layer to at least one interior surface of a thermally conductive shell; attaching a thermally conductive layer of a thermally conductive electrical cord to the thermally conductive shell; and inserting, to form a thermally conductive interface between an outer surface of the heat-producing electronic module and an interior surface of the thermally conductive shell, the heat-producing electronic module into the thermally conductive shell, the heat-producing electronic module being an optoelectronic module.