Thermal expansion compensators for controlling microelectronic package warpage

摘要

The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.

主权项

1. A microelectronic package, comprising:
a microelectronic interposer has at least one conductive route extending from a device attachment surface of the microelectronic interposer to an opposing back surface of the microelectronic interposer; a microelectronic device attached to the microelectronic interposer device attachment surface; and a warpage compensator attached to the microelectronic interposer back surface, wherein a periphery of the warpage compensator includes a periphery that is substantially planar to a periphery of the microelectronic device and wherein the warpage compensator includes an opening therethrough.